Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions

Teerlinck, IvoIvoTeerlinckMertens, PaulPaulMertensSchmidt, HaraldHaraldSchmidtMeuris, MarcMarcMeurisHeyns, MarcMarcHeyns2021-09-292021-09-291996https://imec-publications.be/handle/20.500.12860/1525Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutionsJournal article