Chemical mechanical polishing for indium bond pad damascene processing

Ceulemans, KarlKarlCeulemansShafahian, EhsanEhsanShafahianStruyf, HerbertHerbertStruyfDevriendt, KatiaKatiaDevriendtDeckers, StevenStevenDeckersHeylen, NancyNancyHeylenDerakhshandeh, JaberJaberDerakhshandeh2024-09-162024-03-022024-09-1620240021-4922WOS:001165001500001https://imec-publications.be/handle/20.500.12860/43617Chemical mechanical polishing for indium bond pad damascene processingJournal article10.35848/1347-4065/ad2135WOS:001165001500001MODELPLANARIZATION