Metallization of 3D via structures in silicon for interconnect technology

Luhn, OleOleLuhnVan Hoof, ChrisChrisVan HoofRuythooren, WouterWouterRuythoorenCelis, Jean-PierreJean-PierreCelis2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14078Metallization of 3D via structures in silicon for interconnect technologyMeeting abstract