Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alteration

Jacobs, Kristof J.P.Kristof J.P.JacobsKim, Soon-WookSoon-WookKimDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-282021-10-282020https://imec-publications.be/handle/20.500.12860/35316Fault isolation of resistive/open 3D wafer bonding interconnects by thermal laser stimulation and light-induced capacitance alterationProceedings paperhttps://asm.confex.com/asm/istfa20/webprogram/Paper51531.html