Thermal stability of copper through-silicon via barriers during IC processing

Civale, YannYannCivaleCroes, KristofKristofCroesMiyamori, YuichiYuichiMiyamoriThangaraju, SarasvathiSarasvathiThangarajuRedolfi, AugustoAugustoRedolfiVan Ammel, AnnemieAnnemieVan AmmelVelenis, DimitriosDimitriosVelenisCherman, VladimirVladimirChermanHendrickx, PaulPaulHendrickxVan der Plas, GeertGeertVan der PlasCockburn, AndrewAndrewCockburnGravey, VirginieVirginieGraveyKumar, NirajanNirajanKumarZhitao, CaoCaoZhitaoSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSoussan, PhilippePhilippeSoussanTravaly, YoussefYoussefTravalyTokei, ZsoltZsoltTokeiBeyne, EricEricBeyneSwinnen, BartBartSwinnen2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18701Thermal stability of copper through-silicon via barriers during IC processingProceedings paper