Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages

Wei, TiweiTiweiWeiOprins, HermanHermanOprinsCherman, VladimirVladimirChermanDe Wolf, IngridIngridDe WolfVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyneBaelmans, MartineMartineBaelmans2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34430Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packagesProceedings paperhttps://ieeexplore.ieee.org/abstract/document/8757402