Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart II

Hao, Qin-FenQin-FenHaoChen, Kuan-NengKuan-NengChenGoel, Sandeep KumarSandeep KumarGoelLi, HaiHaiLiMarinissen, Erik JanErik JanMarinissen2026-04-272026-04-2720252156-33572156-3365https://imec-publications.be/handle/20.500.12860/59216engGuest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and TestPart IIEditorial material10.1109/jetcas.2025.3637354WOS:0016496593000072156-3365