Plasma-induced damage reduction in porous SiOCH dielectrics by replacement of H2 and N2 by CH2F2 and Ar in fluorocarbon based plasmas

Souriau, LaurentLaurentSouriauLazzarino, FredericFredericLazzarinoCarbonell, LaureLaureCarbonellCiofi, IvanIvanCiofiVerdonck, PatrickPatrickVerdonckde Marneffe, Jean-FrancoisJean-Francoisde MarneffeBaklanov, MikhaïlMikhaïlBaklanov2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19815Plasma-induced damage reduction in porous SiOCH dielectrics by replacement of H2 and N2 by CH2F2 and Ar in fluorocarbon based plasmasMeeting abstract