A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

Bogaerts, LieveLieveBogaertsPhommahaxay, AlainAlainPhommahaxayRottenberg, XavierXavierRottenbergNaito, YasyukiYasyukiNaitoDe Coster, JeroenJeroenDe CosterVarela Pedreira, OlallaOlallaVarela PedreiraVan Hoovels, NeleNeleVan HoovelsCherman, VladimirVladimirChermanHelin, PhilippePhilippeHelinOnishi, K.K.OnishiTilmans, HarrieHarrieTilmans2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18590A MEMS 0-level packaging technology based on CuSn/Cu chip capping bondingProceedings paper