Coello-Vera, A.A.Coello-VeraVendier, O.O.VendierBeyne, EricEricBeyneVan Hoof, RitaRitaVan HoofPinel,PinelBailbé, J.P.J.P.Bailbé2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4985UTCS: ultra thin chip stacking a WSI emulation technologyProceedings paper