Improving the QFN Board level Reliability using Low Melting LMPAQ Solder

Vandevelde, BartBartVandeveldeLabie, RietRietLabieLauwaert, R.R.LauwaertTelizsewski, S.S.TelizsewskiWerkhoven, D.D.Werkhoven2021-10-292021-10-292020https://imec-publications.be/handle/20.500.12860/36199Improving the QFN Board level Reliability using Low Melting LMPAQ SolderProceedings paper