Carbonell, LaureLaureCarbonellVolders, HennyHennyVoldersHeylen, NancyNancyHeylenKellens, KristofKristofKellensCaluwaerts, RudyRudyCaluwaertsDevriendt, KatiaKatiaDevriendtAltamirano Sanchez, EfrainEfrainAltamirano SanchezWouters, Johan M. D.Johan M. D.WoutersGravey, VirginieVirginieGraveyShah, KavitaKavitaShahLuo, QianQianLuoSundarrajan, ArvindArvindSundarrajanLu, JiangJiangLuAubuchon, JosephJosephAubuchonMa, PaulPaulMaNarasimhan, MuraliMuraliNarasimhanCockburn, AndrewAndrewCockburnTokei, ZsoltZsoltTokeiBeyer, GeraldGeraldBeyer2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15063Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinationsProceedings paper