Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assemblies

Vanfleteren, JanJanVanfleteren2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24737Ultra-thin chip package (UTCP) and elastic circuit technologies for compact or conformable sensor and electronics assembliesMeeting abstract