High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Druais, GaelGaelDruaisDilliway, GabrielaGabrielaDilliwayFischer, P.P.FischerGuidotti, E.E.GuidottiBureau, C.C.BureauPalmans, RogerRogerPalmansRadisic, AlexAlexRadisic2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13678High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seedMeeting abstract