Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips

Thienpont, H.H.ThienpontBaukens, V.V.BaukensVolckaerts, B.B.VolckaertsOttevaere, H.H.OttevaereDebaes, C.C.DebaesVervaeke, M.M.VervaekeTuteleers, P.P.TuteleersVynck, P.P.VynckHermanne, A.A.HermanneHanney, M.M.HanneyBrunfaut, MarnikMarnikBrunfautVan Campenhout, JanJanVan CampenhoutVeretennicoff, I.I.Veretennicoff2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5704Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chipsProceedings paper