Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process

Degryse, DominiekDominiekDegryseVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10361Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding processProceedings paper