Small pitch, high aspect ratio via-last TSV module

Van Huylenbroeck, StefaanStefaanVan HuylenbroeckStucchi, MicheleMicheleStucchiLi, YunlongYunlongLiSlabbekoorn, JohnJohnSlabbekoornTutunjyan, NinaNinaTutunjyanSardo, StefanoStefanoSardoJourdan, NicolasNicolasJourdanBogaerts, LieveLieveBogaertsBeirnaert, FilipFilipBeirnaertBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27469Small pitch, high aspect ratio via-last TSV moduleProceedings paperhttp://ieeexplore.ieee.org/document/7545409/?arnumber=7545409