Improving the copper electroplating process for 3D-stacked integrated circuits

Luhn, OleOleLuhnRadisic, AlexAlexRadisicRuythooren, WouterWouterRuythoorenVereecken, PhilippePhilippeVereeckenCelis, Jean-PierreJean-PierreCelisVan Hoof, ChrisChrisVan HoofSwinnen, BartBartSwinnen2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14074Improving the copper electroplating process for 3D-stacked integrated circuitsJournal article