Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement

Van den Bosch, GeertGeertVan den BoschDriessens, EvelienEvelienDriessensWebers, TomasTomasWebersElattari, BrahimBrahimElattariWojchiechowski, DominiqueDominiqueWojchiechowskiGassot, PierrePierreGassotMoens, PeterPeterMoensGroeseneken, GuidoGuidoGroeseneken2021-10-162021-10-162005-04https://imec-publications.be/handle/20.500.12860/11370Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvementProceedings paper