Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitch

Cherman, VladimirVladimirChermanVan Huylenbroeck, StefaanStefaanVan HuylenbroeckLofrano, MelinaMelinaLofranoChang, XinyueXinyueChangOprins, HermanHermanOprinsGonzalez, MarioMarioGonzalezVan der Plas, GeertGeertVan der PlasBeyer, GeraldGeraldBeyerRebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyne2021-12-162021-11-022021-12-1620200569-5503WOS:000620983200081https://imec-publications.be/handle/20.500.12860/38148Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5 mu m pitchProceedings paper10.1109/ECTC32862.2020.00092978-1-7281-6180-8WOS:000620983200081