Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications

Jourdain, AnneAnneJourdainPhommahaxay, AlainAlainPhommahaxayVerbinnen, GreetGreetVerbinnenMurdoch, GayleGayleMurdochMiller, AndyAndyMillerRebibis, Kenneth JuneKenneth JuneRebibisGuerrero, AliceAliceGuerreroMcCutcheon, JeremyJeremyMcCutcheonPrivett, MarkMarkPrivettNeidrich, JasonJasonNeidrichBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22557Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applicationsProceedings paper