Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

Kennes, KoenKoenKennesPhommahaxay, AlainAlainPhommahaxayGuerrero, AliceAliceGuerreroBauder, OlgaOlgaBauderSuhard, SamuelSamuelSuhardBex, PieterPieterBexIacovo, SerenaSerenaIacovoLiu, XiaoXiaoLiuSchmidt, ThomasThomasSchmidtBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2022-01-132021-11-022022-01-1320200569-5503WOS:000620983200044https://imec-publications.be/handle/20.500.12860/38153Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die TransferProceedings paper10.1109/ECTC32862.2020.00056978-1-7281-6180-8WOS:000620983200044