Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayers

Maestre Caro, ArantxaArantxaMaestre CaroArmini, SilviaSilviaArminiRichard, OlivierOlivierRichardMaes, GuidoGuidoMaesBorghs, GustaafGustaafBorghsWhelan, Caroline M.Caroline M.WhelanTravaly, YoussefYoussefTravaly2021-10-182021-10-1820101616-301Xhttps://imec-publications.be/handle/20.500.12860/17546Bottom-up engineering of subnanometer copper diffusion barriers using NH2-derived self assembled monolayersJournal article