Labie, RietRietLabieWebers, TomasTomasWebersWinters, ChristopheChristopheWintersCherman, VladimirVladimirChermanCroes, KristofKristofCroesVandevelde, BartBartVandeveldeDosseul, FranckFranckDosseul2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/19231Electromigration failure mechanisms for different flip chip configurationsProceedings paper