van den Ende, DaanDaanvan den Endevan de Wiel, H.J.H.J.van de WielKusters, RoelRoelKustersSridhar, AshokAshokSridharSchram, JeroenJeroenSchramCauwe, MaartenMaartenCauwevan den Brand, JeroenJeroenvan den Brand2021-10-222021-10-2220140026-2714https://imec-publications.be/handle/20.500.12860/24671Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bendingJournal articlehttp://www.sciencedirect.com/science/article/pii/S0026271414003278