Reliability challenges related to TSV integration and 3D stacking

Croes, KristofKristofCroesDe Messemaeker, JokeJokeDe MessemaekerLi, YunlongYunlongLiGuo, WeiWeiGuoVarela Pedreira, OlallaOlallaVarela PedreiraCherman, VladimirVladimirChermanStucchi, MicheleMicheleStucchiDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-232021-10-2320162168-2355https://imec-publications.be/handle/20.500.12860/26485Reliability challenges related to TSV integration and 3D stackingJournal articlehttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7329942