Characterization of the post dry-etch cleaning of silicon for Ti-self-aligned silicide technology

Kim, Young-ChangYoung-ChangKimBaklanov, MikhaïlMikhaïlBaklanovConard, ThierryThierryConardde Potter de ten Broeck, MurielMurielde Potter de ten BroeckVanhaelemeersch, SergeSergeVanhaelemeersch2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3555Characterization of the post dry-etch cleaning of silicon for Ti-self-aligned silicide technologyJournal article