Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer

Phommahaxay, AlainAlainPhommahaxayGuerrero, AliceAliceGuerreroJourdain, AnneAnneJourdainPotoms, GoedeleGoedelePotomsVerbinnen, GreetGreetVerbinnenBai, DongshunDongshunBaiYess, KimKimYessArnold, KimKimArnoldSleeckx, ErikErikSleeckxBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/29174Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transferMeeting abstracthttp://ieeexplore.ieee.org/document/7999771/