Optimization of a silicone under the bump (SUB) structure for wafer level packaging

Gonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeVanden Bulcke, MathieuMathieuVanden BulckeWinters, ChristopheChristopheWintersBeyne, EricEricBeyneLee, Y.J.Y.J.LeeLarson, L.L.LarsonHarkness, B.R.B.R.HarknessMohamed, M.M.MohamedMeynen, H.H.Meynen2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7619Optimization of a silicone under the bump (SUB) structure for wafer level packagingProceedings paper