Impact of different level copper interconnection on hot carrier lifetime of 0.18μm CMOS process

Wan, XinggongXinggongWanDe Jaeger, BriceBriceDe JaegerHan, YongzhaoYongzhaoHan2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9897Impact of different level copper interconnection on hot carrier lifetime of 0.18μm CMOS processProceedings paper