Surface planarization of Cu/Sn micro-bump and its application in fine pitch Cu/Sn solid state diffusion bonding

Zhang, WenqiWenqiZhangLimaye, PareshPareshLimayeAgarwal, RahulRahulAgarwalSoussan, PhilippePhilippeSoussan2021-10-192021-10-192010https://imec-publications.be/handle/20.500.12860/18418Surface planarization of Cu/Sn micro-bump and its application in fine pitch Cu/Sn solid state diffusion bondingProceedings paper