Ghosh, SouvikSouvikGhoshMedina Silva, HenryHenryMedina SilvaSmets, QuentinQuentinSmetsSchram, TomTomSchramGroven, BenjaminBenjaminGrovenBrems, StevenStevenBremsLockhart de la Rosa, Cesar JavierCesar JavierLockhart de la RosaKar, Gouri SankarGouri SankarKar2026-10-152026-10-152025979-8-3315-4313-6https://imec-publications.be/handle/20.500.12860/60560We present our efforts to facilitate 300mm MX2 growth on sapphire and completely automate the layer transfer module. Two concepts are presented; a collective die-to wafer approach (CoD2W), and a 300mm wafer-to-wafer approach (W2W), both with the vision of enabling MX2 integration in foundries for BEOL and/or FEOL applications.engProceedings paper10.1109/vlsitsa64674.2025.11046891WOS:001821328700074