Armini, SilviaSilviaArminiTokei, ZsoltZsoltTokeiVolders, HennyHennyVoldersEl-Mekki, ZaidZaidEl-MekkiRadisic, AlexAlexRadisicBeyer, GeraldGeraldBeyerRuythooren, WouterWouterRuythoorenVereecken, PhilippePhilippeVereecken2021-10-192021-10-1920110167-9317https://imec-publications.be/handle/20.500.12860/18489Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization optionsJournal article10.1016/j.mee.2010.08.013