Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Chanson, RomainRomainChansonTillocher, ThomasThomasTillocherLefaucheux, PhilippePhilippeLefaucheuxDussart, RemiRemiDussartZhang, LipingLipingZhangde Marneffe, Jean-FrancoisJean-Francoisde MarneffeShen, PPShenDussarrat, ChrsitianChrsitianDussarratMaekawa, KaoruKaoruMaekawayatsuda, koichikoichiyatsudaTahara, ShigeruShigeruTahara2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30390Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damageMeeting abstracthttp://www.dry-process.org/2018/index.html