Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems

Phommahaxay, AlainAlainPhommahaxaySuhard, SamuelSamuelSuhardBex, PieterPieterBexIacovo, SerenaSerenaIacovoSlabbekoorn, JohnJohnSlabbekoornInoue, FumihiroFumihiroInouePeng, LanLanPengKennes, KoenKoenKennesSleeckx, ErikErikSleeckxBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33796Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systemsMeeting abstracthttps://ieeexplore.ieee.org/document/8811420