A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

Podpod, ArnitaArnitaPodpodSlabbekoorn, JohnJohnSlabbekoornPhommahaxay, AlainAlainPhommahaxayDuval, FabriceFabriceDuvalSalahouelhadj, AbdellahAbdellahSalahouelhadjGonzalez, MarioMarioGonzalezRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31548A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitchProceedings paperhttps://ieeexplore.ieee.org/abstract/document/8429576/