Interactions of double patterning technology with wafer processing, OPC and design flows

Lucas, KevinKevinLucasCork, ChrisChrisCorkMiloslavsky, AlexAlexMiloslavskyLuk-Pat, GerryGerryLuk-PatBarnes, LeviLeviBarnesHapli, JohnJohnHapliLewellen, JohnJohnLewellenRollins, GregGregRollinsWiaux, VincentVincentWiauxVerhaegen, StafStafVerhaegen2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14073Interactions of double patterning technology with wafer processing, OPC and design flowsProceedings paper