Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB

Mirdamadi, S. HosseinS. HosseinMirdamadiDerakhshandeh, JaberJaberDerakhshandehCochet, TomTomCochetBeyne, EricEricBeyneBeyer, GeraldGeraldBeyerMiller, AndyAndyMillermirda2022-01-272021-11-022022-01-272020naWOS:000631824100008https://imec-publications.be/handle/20.500.12860/38043Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCBProceedings paper10.1109/ESTC48849.2020.9229662978-1-7281-6293-5WOS:000631824100008