Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish

Ratchev, PetarPetarRatchevVandevelde, BartBartVandeveldeDe Wolf, IngridIngridDe Wolf2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8061Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finishProceedings paper