Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic component

Kaur, KamalpreetKamalpreetKaurMissinne, JeroenJeroenMissinneVandecasteele, BjornBjornVandecasteeleVan Steenberge, GeertGeertVan SteenbergePerinchery, S.M.S.M.PerincherySmits, E.C.P.E.C.P.SmitsMandamparabil, R.R.Mandamparabil2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22572Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic componentMeeting abstract