Reliability analysis of flip chip assemblies mounted on BCB thin film layered substrates

Degryse, DominiekDominiekDegryseVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4304Reliability analysis of flip chip assemblies mounted on BCB thin film layered substratesProceedings paper