Die-to-die adhesive bonding procedure for evanescently-coupled photonic devices

Stankovic, StevanStevanStankovicJones, R.R.JonesHeck, J.J.HeckSysak, M.M.SysakVan Thourhout, DriesDriesVan ThourhoutRoelkens, GuntherGuntherRoelkens2021-10-192021-10-192011-051099-0062https://imec-publications.be/handle/20.500.12860/19830Die-to-die adhesive bonding procedure for evanescently-coupled photonic devicesJournal article