Cu Pad Height Evaluation Technique Using Four-Directional BSE Signal of SEM for Hybrid Bonding Applications

Kasai, HiroakiHiroakiKasaiDoi, YukiYukiDoiOsaki, MayukaMayukaOsakiHasumi, KazuhisaKazuhisaHasumiMise, NobuyukiNobuyukiMiseTanaka, MakiMakiTanakaChew, Soon AikSoon AikChewTunca Altintas, BensuBensuTunca AltintasBogdanowicz, JanuszJanuszBogdanowiczMoussa, AlainAlainMoussaSaib, MohamedMohamedSaibZhang, BoyaoBoyaoZhangCharley, Anne-LaureAnne-LaureCharleyLorusso, GianGianLorusso2025-07-282025-07-282025978-1-5106-8638-00277-786XWOS:001514426300049https://imec-publications.be/handle/20.500.12860/45960Cu Pad Height Evaluation Technique Using Four-Directional BSE Signal of SEM for Hybrid Bonding ApplicationsProceedings paper10.1117/12.3051014978-1-5106-8639-7WOS:001514426300049