Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Vakanas, GeorgeGeorgeVakanasWang, TengTengWangTatsumi, KojiKojiTatsumiMarinissen, Erik JanErik JanMarinissenRebibis, Kenneth JuneKenneth JuneRebibisCherman, VladimirVladimirChermanCroes, KristofKristofCroesHua, FayFayHuaDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24657Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stackingMeeting abstracthttp://www.programmaster.org/PM/PM.nsf/ApprovedAbstracts/43CE740C1845254685257B98004437BA?OpenDocument