3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Daily, RobertRobertDailyCapuz, GiovanniGiovanniCapuzWang, TengTengWangBex, PieterPieterBexStruyf, HerbertHerbertStruyfSleeckx, ErikErikSleeckxDemeurisse, CarolineCarolineDemeurisseAttard, A.A.AttardEberharter, W.W.EberharterKlingler, H.H.Klingler2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/251193D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assemblyMeeting abstracthttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7111000