The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplers

Carchon, GeertGeertCarchonBrebels, StevenStevenBrebelsPieters, PhilipPhilipPietersVaesen, KristofKristofVaesenVandenberghe, S.S.VandenbergheSchreurs, DominiqueDominiqueSchreursDe Raedt, WalterWalterDe RaedtNauwelaers, BartBartNauwelaers2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3288The influence of the bumping height on the performance of flip-chipped microwave circuits, application to coplanar Lange couplersProceedings paper