Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays application

Vanfleteren, JanJanVanfleterenVandecasteele, BjornBjornVandecasteelePodprocky, T.T.Podprocky2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6997Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays applicationProceedings paper