Wafer thinning and back side processing to enable 3D stacking

Detalle, MikaelMikaelDetalleBogaerts, LieveLieveBogaertsLa Manna, AntonioAntonioLa MannaBuisson, ThibaultThibaultBuissonVelenis, DimitriosDimitriosVelenisBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20596Wafer thinning and back side processing to enable 3D stackingProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6542113&queryText%3DWafer+thinning+and+back+side+processing+to+en