Beyne, EricEricBeyneHo, MengMengHoStoukatch, SergueiSergueiStoukatchLam, Kan WaiKan WaiLamRatchev, PetarPetarRatchevDegryse, DominiekDominiekDegryseVath III, C.J.C.J.Vath III2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7209Copper wire bonding to advanced copper back-end integrated circuitsOral presentation