A novel resist and post-etch residue removal process using ozonated chemistry

De Gendt, StefanStefanDe GendtSnee, PeterPeterSneeCornelissen, IngridIngridCornelissenLux, MarcelMarcelLuxVos, RitaRitaVosMertens, PaulPaulMertensKnotter, MartinMartinKnotterMeuris, MarcMarcMeurisHeyns, MarcMarcHeyns2021-09-302021-09-301998https://imec-publications.be/handle/20.500.12860/2492A novel resist and post-etch residue removal process using ozonated chemistryOral presentation